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Skorpios Technologies
Skorpios Technologies operates a silicon photonics foundry and Tru-SiPh platform for optical communication, lidar, and biosensors. Based in Temecula, CA.
Skorpios Technologies
Skorpios Technologies was founded to develop integrated optical communication products using its proprietary Tru-SiPh platform, which embeds lasers, modulators, and photodiodes directly into silicon wafers. The firm operates a 450,000 sq ft manufacturing facility in Temecula, California, equipped with more than 125 production tools for 200mm and 300mm wafers. Additional offices exist in Espoo, Finland; Albuquerque, New Mexico; and Stockholm, Sweden. Skorpios focuses on silicon photonics for ethernet pluggable modules, co-packaged optics, lidar, and biosensor applications. The Tru-SiPh platform uses a wafer-scale process to bond thin III-V epitaxies to silicon substrates, producing temperature-insensitive optics that require no external cooling. The company also offers foundry services including fab services, test wafers, and analytical services. Distributors MITS Component & System Corp. (Taiwan) and EPS Global (China) handle sales in Asia. The firm reported in early 2025 that its Tru-SiPh lasers achieved a record 0.35 FIT laser reliability, a benchmark for silicon photonics infrastructure. In 2024, Skorpios announced 1.6 Tbps and 6.4 Tbps optical engines designed for AI data centers, aiming to lower cost-per-bit. The company has not disclosed its team size or total external capital raised. Unlike most photonics companies that rely on discrete components, Skorpios integrates all active optical elements—lasers, modulators, photodiodes—directly on silicon wafers using its proprietary heterogeneous bonding process. This architecture yields hermetically sealed, chip-level photonic systems without additional packaging, which the firm claims simplifies manufacturing and reduces costs for hyperscale applications.
General information
Firm type
other
Year founded
—
AUM
Undisclosed
Location
Region
North America
Country
United States
City
Temecula
Corporate office
41915 Business Park Dr., Temecula, CA 92590-3637, United States
Additional offices
Espoo, Finland · Albuquerque, New Mexico · Stockholm, Sweden
Sector focus
Frequently asked questions
What is the Tru-SiPh platform?
Tru-SiPh is Skorpios' proprietary wafer-scale silicon photonics platform that integrates III-V compounds directly into silicon wafers. It embeds lasers, modulators, and photodiodes on a single chip, producing temperature-insensitive optics without external cooling. The platform targets ethernet modules, co-packaged optics, lidar, and biosensors.
Does Skorpios offer foundry services?
Yes, Skorpios provides foundry services including fab services, test wafers, and analytical services. These are listed on their contact page alongside product inquiries. The firm operates a 450,000 sq ft facility with copper back-end-of-line capability and an onsite analytical lab.
What is the manufacturing capacity of Skorpios' facility?
Skorpios' Temecula facility spans 450,000 sq ft and includes 125+ production tools for 200mm and 300mm wafers, 60k sq ft of development and manufacturing space, and 40k sq ft of fab expansion area. The site supports full-flow silicon photonics fabrication.
Who are Skorpios' distributors?
Skorpios has distributors in Asia: MITS Component & System Corp. for Taiwan and EPS Global for China. These partners handle regional sales of Skorpios' silicon photonics products.
What applications does Skorpios' technology serve?
Skorpios' Tru-SiPh platform is designed for ethernet pluggable modules, co-packaged optics, coherent products, lidar, and biosensor applications. The firm also produces direct detect products and components for data center interconnects.
What photonic components does Skorpios manufacture?
Skorpios produces lasers (single-frequency DBR and tunable lasers with <70kHz linewidth), modulators (electroabsorption and InP Mach-Zehnder), photodiodes (high bandwidth and monitor), and optical elements including gratings, couplers, splitters, and spot-size converters.
How does Skorpios' process differ from standard silicon photonics?
Skorpios uses a proprietary heterogeneous bonding process that embeds III-V compounds directly within silicon wafers, as opposed to attaching discrete dies. This yields natively hermetically sealed chips with all active optical elements integrated, eliminating alignment steps and separate packaging.
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