Skorpios Technologies

Tru-SiPh is Skorpios' proprietary wafer-scale silicon photonics platform that integrates III-V compounds directly into silicon wafers. It embeds lasers, modulators, and photodiodes on a single chip, producing temperature-insensitive optics without external cooling. The platform targets ethernet modules, co-packaged optics, lidar, and biosensors.

Yes, Skorpios provides foundry services including fab services, test wafers, and analytical services. These are listed on their contact page alongside product inquiries. The firm operates a 450,000 sq ft facility with copper back-end-of-line capability and an onsite analytical lab.

Skorpios' Temecula facility spans 450,000 sq ft and includes 125+ production tools for 200mm and 300mm wafers, 60k sq ft of development and manufacturing space, and 40k sq ft of fab expansion area. The site supports full-flow silicon photonics fabrication.

Skorpios has distributors in Asia: MITS Component & System Corp. for Taiwan and EPS Global for China. These partners handle regional sales of Skorpios' silicon photonics products.

Skorpios' Tru-SiPh platform is designed for ethernet pluggable modules, co-packaged optics, coherent products, lidar, and biosensor applications. The firm also produces direct detect products and components for data center interconnects.

Skorpios produces lasers (single-frequency DBR and tunable lasers with <70kHz linewidth), modulators (electroabsorption and InP Mach-Zehnder), photodiodes (high bandwidth and monitor), and optical elements including gratings, couplers, splitters, and spot-size converters.

Skorpios uses a proprietary heterogeneous bonding process that embeds III-V compounds directly within silicon wafers, as opposed to attaching discrete dies. This yields natively hermetically sealed chips with all active optical elements integrated, eliminating alignment steps and separate packaging.